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Wire To Board Connectors 3.0mm to 6.35mm,Wires
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Meet industry standard 3.0mm Micro fit wafer and housing
Black insulator with option of UL 94v-0 and UL 94v-2
Locking feature to secured mating
Work with wire 20AWG to 30AWG
Current rating 1A to 5A
Kinked leads with better retention on PCB
Surface Mount Right Angle and Vertical type available
Tape and Reel package available for automatic production

3.0mm 4976 Series

4976-1(2)XxxFHB and 4976-PIN-MTx-10K

Part No.

4976-1(2)XxxFHB and 4976-PIN-MTx-10K

Desc.

Housing 3.0mm Female Single/Dual, Mating Male Terminal Tin 20-24AWG and 26-30AWG

4976-1(2)XxxMHB and 4976-PIN-FTx-10K

Part No.

4976-1(2)XxxMHB and 4976-PIN-FTx-10K

Desc.

Housing 3.0mm Male Single/Dual, Mating Female Terminal Tin 20-24AWG and 26-30AWG

4976-1XxxTD1LT

Part No.

4976-1XxxTD1LT

Desc.

Wafer 3.00mm Single SMD RA Tin Metal lock 2 to 12pin

4976-1XxxTD1T

Part No.

4976-1XxxTD1T

Desc.

Wafer 3.00mm Single SMD RA Tin Solder pad 2 to 12pin

4976-1XxxTD3LT-M

Part No.

4976-1XxxTD3LT-M

Desc.

Wafer 3.00mm Single SMD Vertical Tin Metal lock 2 to 12pin

4976-1XxxTD3T-M

Part No.

4976-1XxxTD3T-M

Desc.

Wafer 3.00mm Single SMD Vertical Tin Solder pad 2 to 12pin

4976-1XxxTRB

Part No.

4976-1XxxTRB

Desc.

Wafer 3.00mm Single DIP RA Tin Molded alignment post 2 to 12pin

4976-1XxxTSB

Part No.

4976-1XxxTSB

Desc.

Wafer 3.00mm Single DIP STR Tin Kinked leads 2 to 12pin

4976-2XxxTD1LT

Part No.

4976-2XxxTD1LT

Desc.

Wafer 3.00mm Dual SMD RA Tin Metal lock 2 to 24pin

4976-2XxxTD1T

Part No.

4976-2XxxTD1T

Desc.

Wafer 3.00mm Dual SMD RA Tin Solder pad 2 to 24pin

4976-2XxxTD3LT-M

Part No.

4976-2XxxTD3LT-M

Desc.

Wafer 3.00mm Dual SMD Vertical Tin Metal lock 2 to 24pin

4976-2XxxTD3T-M

Part No.

4976-2XxxTD3T-M

Desc.

Wafer 3.00mm Dual SMD Vertical Tin Solder pad 2 to 24pin

4976-2XxxTRB

Part No.

4976-2XxxTRB

Desc.

Wafer 3.00mm Dual DIP RA Tin Molded alignment post 2 to 24pin

4976-2XxxTSB

Part No.

4976-2XxxTSB

Desc.

Wafer 3.00mm Dual DIP STR Tin Kinked leads 2 to 24pin